led array ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-la236b/g rev : a date : 15 - aug. - 2005 la236b/g
25.0min 1.5max 2.54typ ?? 0.5typ 5.0 1.0min 3.0 + - 6.0 5.0 3.850.5 3.0 4.5 2.54typ 3.00.5 ?? 0.5typ 2.5 ligitek electronics co.,ltd. property of ligitek only page 1/4 part no. la236b/g package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg2340-1 - + 2.9+0.5 -0.0 3.2
g ligitek electronics co.,ltd. property of ligitek only unit symbol absolute maximum ratings mw ma g a j pd i fp 10 ir t opr -40 ~ +85 120 100 i f ma 30 forward current operating temperature reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter absolute maximum ratings at ta=25 j page 2/4 part no. la236b/g j tstg tsol -40 ~ +100 max 260 j for 5 sec max (2mm from body) color storage temperature typical electrical & optical characteristics (ta=25 j ) soldering temperature typ. min. 80 8.0 20 min. 1.7 565 30 lens emitted green green diffused 2.6 max. la236b/g note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. gap peak wave length f pnm viewing angle 2 c 1/2 (deg) material part no forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @10ma(mcd)
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. la236b/g 3/4
ligitek electronics co.,ltd. property of ligitek only reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. page4/4 part no. la236b/g mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. solder resistance test the purpose of this test is the resistance of the device under tropical for hous.
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